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22-MINUTE WEBINAR: Overcome Thermal Challenges in Electronic Equipment – SOLIDWORKS Flow Simulation
WHAT: Understand how Flow Simulation can help in dissipating the heat out of Electronic enclosures efficiently.

WHEN: July 27th, 2016

10.00 AM Bangkok 
11.00 AM Singapore, Perth
1.00 PM Sydney, Melbourne
3.00 PM Auckland


WHO SHOULD ATTEND: Electronics enclosure designers, Product Engineers

In just 22 minutes, learn how SOLIDWORKS® Simulation can help you:

  • Increase efficient thermal dissipation from electronic enclosures

Space is limited, so sign up today to take advantage of this webcast.

Kapil has more than 15 years of experience in the field of Design Analysis and has helped many designers implement Simulation solution in their design cycle.
 REGISTER HERE for the session in your corresponding time zone

 REQUEST A QUOTE to put SOLIDWORKS Solutions to work for your company.

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